Epson NX1032XS IC Test Handler

Dibuat untuk Menghasilkan Handler yang Paling Andal dan Akurat

Dikembangkan dengan menggunakan teknologi robot mutakhir, IC test handler ini menawarkan peningkatan performa yang signifikan untuk mendukung bahkan pengujian yang paling mendesak sekalipun.

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Overview

Pengujian Multi-situs Serentak
Hasil maksimum hingga 20.000 chip per jam dengan pengujian multi-situs secara simultan untuk 32 perangkat IC dan kekuatan kontak yang tinggi hingga 4.800N.

Menguji Metode Penekan Panas Mandiri
Menguji chip pada suhu setinggi 155°C dan mengurangi waktu kembali dari kesulitan.

Kompatibilitas Mudah
Kompatibel dengan berbagai kit pergantian untuk seri NS yang ada (termasuk kit pergantian yang kompatibel dengan adaptor).

Devices Handled:

Devices Handled: 16-site | 32-site
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA, Min. 3×3 to Max. 50×50 (Lead pitch: 0.4mm or more) *1

Test Mode:

Test Mode: N/A | 32-site (8×4, X: 40mm pitch × Y: 60mm pitch)
16-site (8×2, X: 30mm pitch Y: 60mm pitch, 40mm pitch × Y: 60mm pitch)
8-site (4×2, X: 40mm pitch × Y: 60mm, X: 60mm pitch × Y: 60mm, X: 80mm pitch × Y: 60mm)
4-site (2×2, X: 80mm × Y: 60mm), (4×1, X: 40mm, 60mm, 80mm)
2-site (Socket pitch 80 mm)
Single (use one side of the 2-site test)
Non-standard pitches can be set by laying out the independent compliance unit with desired pitches

Testing Area:

Testing Area: 344 × 146 mm | 344 × 244 mm

Standard Socket Pitch (mm):

Standard Socket Pitch (mm): X: 40mm Y: 60mm

Heating Method:

Heating Method: Heat Press Method

Index Time:

Index Time *2 (common in Ambient and High Temperature modes): Min. 0.38sec.
Approx. 0.42sec. (wide 4×2, 8×2 layout) | Approx. 2.05sec. (8×4 layout)
Approx. 2.21sec. (4,800N Option) | Approx. 4.35sec. (4,800N Option)

Max. Contact Force:

Max. Contact Force: 1,600N (Optional) or 4,800N (Standard) | 3,200N (Optional) or 4,800N (Standard)

Maximum Throughput (units per hour):

Ambient Temperature: 8×4 and 8×2 layouts: 20,000, 4×2 layout: 15,000High Temperature: 8×4 and 8×2 layouts: 10,500, 4×2 layout:10,500

Binning:

Binning: Max. 6 bins (Auto 3, Manual 3)

Tray:

Tray: JEDEC (135.9 × 315.0 mm)

Temperature Accuracy:

Temperature Accuracy: 50 - 90°C ±2°C
90 - 155°C ±3°C

Hot Plate Size:

Hot Plate Size: 220 × 380 mm *3

Handler Dimensions (D x W x H):

Handler Dimensions (D x W x H): 1,580 x 1,940 x 2,000 mm *4

Weight:

Berat: Approx. 1,200kg

Power Requirements:

Rated Voltage/Frequency/Current: Single Phase 200 - 240 V AC, 50/60 Hz, 6 kVA

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